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Automatic Laser Edge Isolation

[Time:2012-03-16 Browsing times:2834]

Laser Edge Isolation


    plication: Laser edge isolation by laser grooving.

    Wafer size: 125mm×125mm/156mm×156mm
    High throughput of up to1,500 wafer/h
    CCD vision system for automatic alignment;
    Low breakage rates
    Available as inline or stand-alone system


For more details, please contact; 86-27-87922379.